Tensor G3, reportedly made by Samsung and based on Exynos 2400, could be the first Samsung Foundry chip to feature FO-WLP packaging (fan-out wafer-level packaging). By enhancing wafer-level packaging, better efficiency, improved graphics performance, and energy savings are theoretically possible.

This is the first time Samsung Foundry is using FO-WLP, which has been used by Qualcomm and MediaTek.

It will have a 9-core CPU – one Cortex-X3 prime core, four Cortex-A715s, and four Cortex-A510s – and will be found in the Pixel 8 and Pixel 8 Pro. It will use the 10-core Arm Immortalis G715 GPU instead of the 7-core G710. On October 4, Google will release the Pixel 8 series.

Pixel 8 Pro:

The new Google Pixel 8 Pro will sport 6.7 inches QHD+ (2992 × 1344p) 120Hz refresh rate LTPO Samsung OLED flat punch-hole display. It comes with Corning Gorilla Glass Victus protection & also gets HDR10+ support.

The new Google Pixel 8 Pro is powered by the new Tensor G3 SoC which comes with a Titan M2 security chip. It is coupled with 12GB RAM and 128GB/256GB storage options.


Google Pixel 8 Pro features triple-rear cameras with a 50MP Samsung GN2 sensor with f/1.85 aperture & OIS. It is coupled with a 64MP Sony IMX787 ultra-wide shooter, 48MP GM5 telephoto lens with 5x optical zoom, and LED flash. The Pixel 8 can shoot 4K videos at 60fps. The Pixel 8 Pro will feature an 11MP selfie shooter with a 4K video recording feature. There is also a temperature sensor this time.

The new Pixel 8 Pro will also feature IP68-rated dust and water resistance and also comes with an in-display fingerprint scanner. It also comes with Stereo speakers.

Although the Google Pixel 8 Pro will have a larger battery than its predecessor – 4,900 mAh & comes with 27W fast wired charging and 23W/12W wireless charging support. It runs on the latest Android 14 OS out of the box.

The connectivity option includes Dual SIM, Wifi-7, A-GPS, GLONASS, Bluetooth 5.2LE, USB Type-C port, NFC, Dual SIM with 4G LTE, 5G with mmWave support.