With the Snapdragon 7 Gen 3, Qualcomm has announced its latest midrange chipset for mobile devices. Despite the naming implying that this is a successor to the SD 7+ Gen 2 or SD 7s Gen 2, it slots between the two previous chips. The SD 7 Gen 3 is manufactured on TSMC’s 4nm process technology and features a 1+3+4 CPU package. In the Kryo CPU, there is a prime core clocked at 2.63GHz, 3 performance cores clocked at 2.4GHz, and 4 efficiency cores clocked at 1.8GHz.

In comparison to last year’s Snapdragon 7 Gen 1, Qualcomm claims a 15% improvement in CPU performance and a 50% boost in Adreno GPU performance. According to Qualcomm, the 7 Gen 3 chip also offers 20% power savings.

Qualcomm Hexagon NPU inside SD 7 Gen 3 should provide 60% faster AI performance per watt than SD 7 Gen 1. OpenGL ES 3.2, OpenCL 2.0 FP, and Vulkan 1.3 APIs are supported by the Adreno GPU.

Additionally, Qualcomm’s new chip supports display resolutions up to 4K at 60Hz or FHD+ at 168Hz. With its Qualcomm Spectra ISP, it can handle up to 200MP main camera modules and record 4K HDR video at 60Hz.

Qualcomm Snapdragon X63 5G Modem-RF System enables up to 5 Gbps download speeds over mmWave and sub-6 GHz bands with SD 7 Gen 3. Additionally, Wi-Fi 6E and Bluetooth 5.3 standards are supported by the connectivity department.

With Honor and Vivo listed as the key OEMs expected to launch the first devices with Snapdragon 7 Gen 3 later this month, the new chip is expected to revolutionize mobile devices.