Dimensity 8300 is MediaTek’s latest 8000-series chipset. As the direct successor to last year’s Dimensity 8200, the new SoC is built on TSMC’s second-generation 4nm process.
Among the features of the Dimensity 8300 are 4x Arm Cortex-A715 performance cores clocked at up to 3.35GHz and 4x Arm Cortex-A510 efficiency units clocked at up to 2.2GHz. MediaTek claims that the Dimensity 8200 has up to 20% faster CPU performance and up to 30% higher peak power efficiency than the outgoing Dimensity 8200 because all eight cores are based on the Armv9 CPU architecture.
It also boasts an Arm Mali-G615 MC6 GPU, which improves power efficiency by 55% at peak speeds over its predecessor by 60%. With the new chip, MediaTek claims up to 17% faster cold app launches and up to 47% faster standby app launches. Furthermore, the new chip supports Quad-channel LPDDR5X RAM at 8,533Mbps and UFS 4.0 storage with Multi-Circular Queue (MCQ).
APU 780 inside Dimensity 8300 enables Generative AI with stable diffusion and support for LLM with up to 10 billion parameters, a first in its class. With Imagiq 980 ISP, you can record 4K video at 60 frames per second with up to 320MP camera sensors.
It features a 5G modem with dual-mode support and can support downlink speeds of up to 5.17Gbps on sub-6GHz networks. Wi-Fi 6E and Bluetooth 5.4 are also integrated into the chip.
Later this month, Xiaomi will launch the Dimensity 8300 with its Redmi K70E.