Xiaomi’s new flagship series is anticipated to arrive sooner than prior generations. The gadget will have top-notch specifications and features, and now a fresh rumor says it will have a new look.

The firm will use a new packaging technique for the Xiaomi 12 according to a tipster on Weibo (a Chinese microblogging website). This new technique would allow Huawei to further reduce the device’s bezels and chin for a better viewing experience.

The hyperboloid display will replace the curved panel in the flagship range, according to the report. The device’s reduced bezels also indicate a greater screen-to-body ratio than previous models.

The triple camera system on the back will also be redesigned, according to the report. A partition design, he said, would now be added to the module’s visual appeal. However, the blogger claims that instead of the previously rumored 200MP main sensor. The Xiaomi 12 series would have a 50-megapixel sensor. We can’t confirm this story yet, so take it with a grain of salt for now and keep tuned for developments.