It is expected that OPPO will announce the Reno 10 series of smartphones in May or June in China. Three models are expected: the Reno 10, Reno 10 Pro, and Reno 10 Pro+. Tipster Digital Chat Station has revealed the name of the chip powering the Reno 10 Pro+ in a new Weibo post.

The Reno 10 Pro+ will be equipped with the Snapdragon 8 Plus Gen 1 chipset, according to DCS. Under the hood of the Reno 9 Pro+, released in November 2022 in China, is the same chip. The vanilla Find X6 series was initially reported to feature the SD8+G1, but it was eventually canceled. The company instead launched the Dimensity 9200-powered Find X6. Reno 10 Pro+ may be a tweaked version of the canceled Find X6.

Specs:

OPPO PHW110 and PHU110 schematics leak, revealing a lot about the upcoming smartphones. DCS describes the first device as having a 6.7-inch Full HD+ screen and a resolution of 2412 x 1080 pixels, and the second as having a 6.74-inch screen and a resolution of 2772 x 1240 pixels. They both have OLED screens with curved edges and central punch holes.

In addition, both phones feature an elliptical-shaped camera module with three cameras and a pill-shaped LED flash on the rear. It is noteworthy that both devices are equipped with a MariSilicon X chip, which suggests they might be Reno 10 Pro models instead of the vanilla version.

Both phones have a different rear design. One device appears to have a telephoto lens with a 2x optical zoom, and the other seems to have a periscope lens. As a result, these phones may eventually be launched in the market as Reno 10 Pro and 10 Pro+.

It is rumored that the PHW110 may have a Dimensity 8200 chipset, while the PHU110 could have a Snapdragon 8+ Gen 1 chip. As of yet, these details have not been confirmed.