Qualcomm upcoming flagship chipset Snapdragon 8150 which was earlier rumored to be called the SD855 has now received the Bluetooth SIG certification. Earlier we had few rumors about the new Snapdragon 8150 which will be Qualcomm first 7nm based processor and will be manufactured by TSMC.
As per the Bluetooth SIG, the new Snapdragon 8150 has just received the Bluetooth 5.1 certified which turns out to be the upgraded version of Bluetooth 5.0. The chipset will further ship with Wi-Fi 802.11 a/b/g/n/ac 2×2 MIMO.
Further, the listing has mentioned WCN3998-0 under Design name which is nothing but the recently announced Wi-Fi 802.11ax standards. The new Wi-Fi 802.11ax consumes 67% lesser power and comes with WPA3 security protocol. Apart from this, nothing much about the chipset is leaked.