Qualcomm is going to launch the next gen of SD 835 with SD 836 and SD 845. The next big thing will be the Qualcomm SD 845 which will feature a new set of Cortex A55 and Cortex A75 cores as per earlier leaks.Now we have some more details about the next-gen SD 845 will be having an X20 LTE Modem according to Linked In profile post of one employee from Qualcomm.

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One of the Qualcomm engineers disclosed that they are working on SDM845 Modem and SD X20 which is based on Gigabit LTE modem which will be included upcoming SD 845 chip.Sd X20 is  LTE category 18 modem which supports download speed up to 1.2Gbps speeds.Many other OEM has also submitted a similar set of modem samples for SD 845 chip but the SD X20 is commercialised for the next gen chip.The SD 845 will also be based on 10nm FinFET technology similar to SD 835.The Sd 845 will support upload speeds up to 150 Mbps with 2X20 MHz carrier aggregation.Sd X20 modem will be specifically designed for next gen of mobile technology with 5G support.But there is SD X50 which is its new chip is the first one of its kind that’s available commercially and the first modem in general capable of simultaneously receiving LTE data from up to 12 streams.

According to many leaks, the SD 845 is already under production phase and will be made available only after Jan 2018. It is expected to arrive with LG G7 and Samsung Galaxy S9 next year.Not only these too many others flagship devices too will be powered by SD 845 chip.

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